Lenovo ThinkSystem SR850 V2
System Board (Motherboard) – Part Number: 03GY151
The Lenovo ThinkSystem SR850 V2 Quad-Socket System Board (03GY151) is the primary baseboard for the SR850 V2 platform. It is designed for mission-critical, high-density computing in a flexible 2U chassis, supporting a dual-socket configuration onboard with expansion capability to four sockets via a processor and memory expansion tray.
Socket Information
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Socket Type: Intel LGA 4189 (FCLGA4189)
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Onboard Configuration: 2 CPU sockets
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Maximum Configuration: 4 CPU sockets (with Processor & Memory Expansion Tray)
The LGA4189 socket supports 3rd Generation Intel Xeon Scalable processors (Cooper Lake architecture).
Processor Support
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Processor Family: 3rd Gen Intel Xeon Scalable (Gold & Platinum tiers)
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Max Cores per CPU: Up to 28 cores / 56 threads
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Maximum Configuration:
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Max Frequency: Up to 3.9 GHz (depending on SKU)
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Maximum TDP: Up to 250W per processor
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Interconnect:
Memory Specifications
Capacity
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Onboard (24 slots): Up to 6TB using 256GB 3DS RDIMMs
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Fully Expanded (48 slots): Up to 12TB system memory
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Persistent Memory Support: Intel Optane Persistent Memory 200 Series
Maximum Combined Capacity (Quad-Socket Mode):
Up to 18TB total using a mix of:
Expansion & I/O
PCIe
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2x Onboard PCIe 3.0 x8 low-profile slots (Slot 7 & Slot 8)
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Multiple riser card options for additional expansion
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Dedicated OCP 3.0 SFF slot (PCIe 3.0 x16 host interface)
Storage Connectivity
Rear I/O Ports
Management & Security
Summary
The Lenovo ThinkSystem SR850 V2 system board (03GY151) features Intel LGA 4189 (FCLGA4189) sockets, supporting dual CPUs onboard and expandable to quad-socket configurations. Designed for mission-critical workloads, it delivers:
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Up to 112 cores
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Up to 18TB combined memory
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250W CPU support
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High-speed UPI mesh interconnect
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Extensive NVMe and PCIe expansion
This makes it ideal for enterprise databases, virtualization clusters, SAP HANA, and large-scale in-memory computing environments.