Intel Xeon Gold 6230R Processor
26 Cores • 52 Threads • 2.10 GHz Base • Up to 4.00 GHz Turbo • 35.75 MB Cache
Overview
The Intel Xeon Gold 6230R is a high-density performance CPU from Cascade Lake Refresh, offering 26 cores, 52 threads, and 35.75 MB of SmartCache. With a base clock of 2.10 GHz and turbo boost up to 4.00 GHz, it’s engineered for dual-socket server platforms, delivering exceptional throughput for virtualization, large-scale databases, AI/ML workloads, and cloud deployments. Launched in Q1 2020, it remains serviced through June 30, 2025.
Key Specifications
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Architecture: Cascade Lake (14 nm)
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Cores / Threads: 26 / 52
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Base Frequency: 2.10 GHz
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Max Turbo Frequency: 4.00 GHz
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Cache: 35.75 MB L3 SmartCache
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TDP: 150 W
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Socket: FCLGA3647
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Scalability: 2-socket systems
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PCIe Lanes: 48 × PCIe 3.0
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UPI Links: 2
Memory & I/O Capabilities
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Memory Support: DDR4‑2933 ECC
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Memory Channels: 6
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Max Memory Capacity: 1 TB per socket
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Memory Bandwidth: ~140 GB/s
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Intel Optane DC Persistent Memory: Supported
Advanced Technologies
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Turbo Boost 2.0
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Hyper-Threading
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AVX‑512 (2 FMA units per core)
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Deep Learning Boost for AI acceleration
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Speed Shift & Resource Director Technology
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Virtualization (VT‑x, VT‑d, EPT)
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AES New Instructions, TSX‑NI
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Volume Management Device (VMD)
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Security & Reliability features: Execute Disable, Trusted Execution, Run Sure, Mode-Based Execute Control
Compatibility & System Support
Supported Platforms:
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Dual‑socket server/workstation motherboards with FCLGA3647 socket and Intel C620-series chipsets
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OEM systems confirmed: Dell PowerEdge R740/R940, HPE ProLiant DL380/ML350 Gen10, Lenovo ThinkSystem SR650, Supermicro LGA3647 platforms
BIOS & Firmware Requirements:
Not Compatible With:
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Consumer desktops or gaming motherboards
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Systems lacking updated BIOS for Xeon Gold Refresh CPUs
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Single-socket boards without support for Xeon Gold 6230R
Recommended Deployment Hardware
| Component |
Requirement |
| Motherboard |
Dual-socket LGA3647 board with C620 chipset, Cascade Lake BIOS |
| Cooling |
Server-grade cooling for 150 W TDP |
| Power Supply |
Minimum 800 W PSU for dual-CPU and expansion loads |
| Memory |
DDR4‑2933 ECC RDIMM/LRDIMM, 6‑ or 12‑channel configurations |
| Chassis |
High‑airflow rack or tower server chassis |
| PCIe Expansion |
Up to 48 PCIe 3.0 lanes per CPU for NVMe, GPU, NICs |