{"product_id":"epo-tek-383nd-high-temperature-epoxy-heat-cure-25g","title":"EPO-TEK® 383ND High Temperature Epoxy, Heat Cure (2.5g)","description":"\u003ch1\u003eEPO-TEK® 383ND High Temperature Optical Epoxy, Heat Cure (2.5g Packet)\u003c\/h1\u003e\n\u003cp\u003eEPO-TEK® 383ND is a high-performance, two-part heat-cure epoxy engineered for fiber optic, photonics, semiconductor, and electronic assembly applications. Designed as an extended working life alternative to EPO-TEK 353ND, it provides the same high-reliability performance while offering a significantly longer pot life of up to 8 hours.\u003c\/p\u003e\n\u003cp\u003eIts low-viscosity formulation enables excellent wicking and capillary flow, making it ideal for optical assemblies, fiber optic packaging, ferrule bonding, and precision component alignment. EPO-TEK 383ND also delivers outstanding optical transmission across visible and near-infrared wavelengths, making it an excellent choice for optical pathways and photonic devices.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 2.5-gram packet for accurate mixing and reduced material waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eExtended 8-Hour Working Life\u003c\/h3\u003e\n\u003cp\u003eProvides significantly longer processing time than EPO-TEK 353ND, making it ideal for complex assemblies, batch processing, and precision alignment applications.\u003c\/p\u003e\n\u003ch3\u003eExcellent Optical Transmission\u003c\/h3\u003e\n\u003cp\u003eDelivers greater than 90% transmission across a broad wavelength range from 520 nm to 1660 nm.\u003c\/p\u003e\n\u003ch3\u003eLow Viscosity for Wicking and Capillary Flow\u003c\/h3\u003e\n\u003cp\u003eFlows easily into narrow gaps, ferrules, and optical assemblies where controlled penetration is required.\u003c\/p\u003e\n\u003ch3\u003eHigh Temperature Performance\u003c\/h3\u003e\n\u003cp\u003eMaintains excellent mechanical and thermal stability in demanding environments.\u003c\/p\u003e\n\u003ch3\u003eVisual Cure Verification\u003c\/h3\u003e\n\u003cp\u003eChanges from clear to dark amber when properly cured, providing a convenient visual indication of cure completion.\u003c\/p\u003e\n\u003ch3\u003eElectrically and Thermally Insulating\u003c\/h3\u003e\n\u003cp\u003eSuitable for electronic packaging, dielectric applications, and electrical insulation requirements.\u003c\/p\u003e\n\u003ch3\u003eDesigned for Fiber Optic Applications\u003c\/h3\u003e\n\u003cp\u003eDeveloped to meet Telcordia GR-1221 requirements for fiber optic component assembly and packaging.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Heat Cure Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 2.5 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConsistency: Pourable Liquid\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eColor Before Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003ePart A: Clear\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePart B: Slightly Yellow\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePhysical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eViscosity at 23°C: 3,500 to 6,000 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): ≥ 100°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 88\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eParticle Size: ≤ 20 Microns\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuggested Operating Temperature:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 350°C Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 662°F Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCoefficient of Thermal Expansion (CTE)\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eBelow Tg: 34 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAbove Tg: 129 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eOptical Properties\u003c\/h2\u003e\n\u003ch3\u003eSpectral Transmission\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eGreater than 90% from 520 nm to 1660 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eRefractive Index\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e1.5715 at 589 nm (Uncured)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWorking Life (Pot Life): Up to 8 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Centrifuge Cycle: 5 to 10 Minutes at 1,000 RPM\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Cure Schedule: 150°C (302°F) for 1 Hour\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003ch3\u003eFiber Optic and Photonics Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic connector assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber ferrule bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical component packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eActive optical alignment\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eV-groove array assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eEnvironmental sealing of optoelectronic packages\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic bundle potting\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eEndoscope light guide assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical sensor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eElectronics Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eCapacitor fabrication\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDielectric layer formation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePZT piezoelectric lamination\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eInkjet device assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eElectronic packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePrecision Industrial Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eStructural bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHard disk drive assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eVoice coil sealing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAnti-disk sealing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-reliability industrial assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eWhy Choose EPO-TEK 383ND?\u003c\/h2\u003e\n\u003cp\u003eEPO-TEK 383ND offers the high reliability and optical performance engineers expect from the EPO-TEK product family while providing a significantly longer 8-hour working life. For applications requiring extended assembly time, precision optical alignment, or large batch processing, 383ND is often the preferred alternative to EPO-TEK 353ND.\u003c\/p\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49083454062848,"sku":"ET383ND-2.5G","price":27.2,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3429BI9737_12697_EPO_TEK_r__383ND_High_Temperature_Epoxy_Heat_Cure_2_5g_IMD_c3123ef0-36eb-4c01-b40b-1d46c3b562dd.webp?v=1785199846","url":"https:\/\/alotechparts.com\/products\/epo-tek-383nd-high-temperature-epoxy-heat-cure-25g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}