{"product_id":"epo-tek-360-low-viscosity-epoxy-heat-cure-4g","title":"EPO-TEK® 360 Low Viscosity Epoxy, Heat Cure (4g)","description":"\u003ch1\u003eEPO-TEK® 360 Low Viscosity Optical Epoxy, Heat Cure (4g Packet)\u003c\/h1\u003e\n\u003cp\u003eEPO-TEK® 360 is a low-viscosity, high-temperature, two-part optical epoxy designed for demanding fiber optic, semiconductor, photonics, and electronic assembly applications. Its exceptionally low viscosity allows for superior wicking and capillary action, making it an ideal choice for fiber termination, underfill applications, optical assemblies, and precision bonding where deep penetration and uniform coverage are required.\u003c\/p\u003e\n\u003cp\u003eThis unfilled optical epoxy provides outstanding light transmission across visible and near-infrared wavelengths while delivering excellent thermal stability, electrical insulation, and long-term reliability. A built-in color change from clear to amber upon curing provides convenient visual confirmation of proper processing.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 4-gram packet for accurate mixing and reduced material waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eUltra-Low Viscosity for Wicking and Capillary Action\u003c\/h3\u003e\n\u003cp\u003eFlows easily into narrow gaps, ferrules, capillaries, and underfill regions for precise and uniform adhesive distribution.\u003c\/p\u003e\n\u003ch3\u003eExcellent Optical Transmission\u003c\/h3\u003e\n\u003cp\u003eUnfilled epoxy formulation provides exceptional transmission in visible and near-infrared wavelengths.\u003c\/p\u003e\n\u003ch3\u003eVisual Cure Verification\u003c\/h3\u003e\n\u003cp\u003eChanges from clear to amber when fully cured, allowing quick inspection and confirmation of proper curing.\u003c\/p\u003e\n\u003ch3\u003eHigh Temperature Performance\u003c\/h3\u003e\n\u003cp\u003eDesigned for demanding thermal environments encountered in optical, electronic, and semiconductor applications.\u003c\/p\u003e\n\u003ch3\u003eExtended Working Life\u003c\/h3\u003e\n\u003cp\u003eProvides up to 6 hours of pot life, allowing ample time for assembly, alignment, and production processing.\u003c\/p\u003e\n\u003ch3\u003eElectrically Insulating\u003c\/h3\u003e\n\u003cp\u003eOffers excellent dielectric properties for electronic packaging and electrical insulation applications.\u003c\/p\u003e\n\u003ch3\u003eStrong Multi-Substrate Adhesion\u003c\/h3\u003e\n\u003cp\u003eBonds well to glass, ceramics, metals, ferrites, optical fibers, and electronic components.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Heat Cure Optical Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 4 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConsistency: Pourable Liquid\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eColor Before Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003ePart A: Clear \/ Colorless\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePart B: Amber\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePhysical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eViscosity at 23°C: 350 to 550 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): ≥ 90°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 87\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuggested Operating Temperature:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 300°C (572°F)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCoefficient of Thermal Expansion (CTE)\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eBelow Tg: 39 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAbove Tg: 175 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eElectrical Properties\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eVolume Resistivity at 23°C: ≥ 2 × 10¹³ Ohm-cm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDielectric Constant (1 kHz): 3.74\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDissipation Factor (1 kHz): 0.011\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eOptical Properties\u003c\/h2\u003e\n\u003ch3\u003eSpectral Transmission\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eGreater than 97% at 700–1600 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGreater than 88% at 600 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGreater than 51% at 500 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eRefractive Index\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e1.5345 at 589 nm (Uncured)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWorking Life (Pot Life): Up to 6 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Cure Schedule: 150°C (302°F) for 1 Hour\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003ch3\u003eFiber Optic and Photonics Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber termination into ferrules\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePolarization-maintaining fiber (PMF) assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical component packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical alignment applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic sensor assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePhotonics device packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSemiconductor Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFlip-chip underfill\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eCapillary-flow underfill applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSemiconductor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMicroelectronic assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eElectronics Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eCopper coil impregnation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSMD inductor coil assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFerrite core bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eElectronic component encapsulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eElectrical insulation applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eWhy Choose EPO-TEK 360?\u003c\/h2\u003e\n\u003cp\u003eEPO-TEK 360 combines extremely low viscosity, excellent optical transmission, and high-temperature performance in a single adhesive system. Its superior capillary action and long working life make it an excellent choice for fiber optic assemblies, semiconductor underfill applications, and precision optical packaging where controlled flow and high optical clarity are essential.\u003c\/p\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49083453931776,"sku":"ET360-4G","price":33.92,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3447BI9769_2284_EPO_TEK_r__360_Low_Viscosity_Epoxy_Heat_Cure_4g_IMD_8f99ff2e-00dc-4a4e-9e59-79ed0f2bd371.webp?v=1785199843","url":"https:\/\/alotechparts.com\/products\/epo-tek-360-low-viscosity-epoxy-heat-cure-4g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}