{"product_id":"epo-tek-353ndt-thixotropic-high-temperature-epoxy-heat-cure-4g","title":"EPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (4g)","description":"\u003ch1\u003eEPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (4g Packet)\u003c\/h1\u003e\n\u003cp\u003eEPO-TEK® 353NDT is a high-performance, two-part thixotropic epoxy engineered for applications requiring exceptional thermal stability, precise adhesive placement, and long-term reliability. Based on the proven EPO-TEK® 353ND chemistry, this non-flowing formulation is ideal for fiber optic assemblies, circuit board manufacturing, hybrid microelectronics, medical devices, and other applications where adhesive migration must be minimized.\u003c\/p\u003e\n\u003cp\u003eIts smooth thixotropic paste consistency allows accurate dispensing onto vertical surfaces and complex assemblies without running, sagging, or spreading. The epoxy also features a built-in amber color change upon curing, providing a convenient visual indication of proper processing.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 4-gram packet for accurate mixing and reduced waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eThixotropic Non-Sag Formula\u003c\/h3\u003e\n\u003cp\u003eDesigned to remain exactly where it is applied, making it ideal for vertical surfaces, gap-filling applications, and assemblies requiring controlled adhesive placement.\u003c\/p\u003e\n\u003ch3\u003eHigh Temperature Performance\u003c\/h3\u003e\n\u003cp\u003eProvides excellent thermal stability and can withstand prolonged exposure to elevated temperatures in demanding environments.\u003c\/p\u003e\n\u003ch3\u003eVisual Cure Verification\u003c\/h3\u003e\n\u003cp\u003eChanges to an amber color after proper curing, allowing easy inspection and confirmation of cure completion.\u003c\/p\u003e\n\u003ch3\u003eExtended Working Time\u003c\/h3\u003e\n\u003cp\u003eOffers up to 3 hours of pot life, providing ample time for assembly, positioning, and alignment.\u003c\/p\u003e\n\u003ch3\u003eStrong Multi-Substrate Adhesion\u003c\/h3\u003e\n\u003cp\u003eBonds effectively to metals, glass, ceramics, and many engineering plastics.\u003c\/p\u003e\n\u003ch3\u003eIdeal for Precision Optical and Electronic Assemblies\u003c\/h3\u003e\n\u003cp\u003eSuitable for fiber optic packaging, circuit assembly, sensor packaging, and high-reliability electronic applications.\u003c\/p\u003e\n\u003ch3\u003eProven High-Reliability Chemistry\u003c\/h3\u003e\n\u003cp\u003eCombines the reliability and environmental resistance of EPO-TEK® 353ND with the advantages of a highly thixotropic, non-flowing formulation.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Thixotropic Heat Cure Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 4 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConsistency: Smooth Thixotropic Paste\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eColor Before Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003ePart A: Tan\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePart B: Amber\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePhysical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eThixotropic Index: 3.8\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eViscosity at 23°C: 9,000 to 15,000 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): ≥ 90°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 80\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eParticle Size: 99% ≤ 20 Microns\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuggested Operating Temperature:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 325°C Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 617°F Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCoefficient of Thermal Expansion (CTE)\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eBelow Tg: 43 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAbove Tg: 231 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWorking Life (Pot Life): Up to 3 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Cure Schedule: 150°C (302°F) for 1 Hour\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003ch3\u003eFiber Optic Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic component assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber ferrule bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical alignment assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptoelectronic device packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eEnvironmental sealing of optical components\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eElectronics and Hybrid Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eCircuit assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHybrid microelectronics\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSensor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eElectronic component bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-temperature electronic assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eMedical and Industrial Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eMedical device assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePrecision instrumentation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eIndustrial sensor systems\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-reliability structural bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eWhy Choose EPO-TEK® 353NDT?\u003c\/h2\u003e\n\u003cp\u003eEPO-TEK® 353NDT combines the proven performance of EPO-TEK® 353ND with a highly thixotropic, non-flowing formulation that enables precise adhesive placement without sagging or migration. It is an excellent choice for applications requiring high-temperature resistance, reliable bonding, and controlled dispensing characteristics.\u003c\/p\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49083452850432,"sku":"ET353NDT-4G","price":28.82,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3433BI9774_9774_EPO_TEK_r__353NDT_Thixotropic_High_Temperature_Epoxy_Heat_Cure_4g_IMD_3e6118dc-f920-481a-9722-626e2c864d0c.webp?v=1785199812","url":"https:\/\/alotechparts.com\/products\/epo-tek-353ndt-thixotropic-high-temperature-epoxy-heat-cure-4g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}