{"product_id":"epo-tek-353ndt-heat-cure-extended-working-life-2-part-epoxy-25-gram-packet-ground-shipment-only","title":"Epo-Tek 353NDT  Heat Cure, Extended Working Life, 2-Part Epoxy, 2.5 Gram Packet (Ground Shipment Only)","description":"\u003cp\u003e\u003cstrong\u003eEPO-TEK® 353NDT Heat Cure, Extended Working Life, 2-Part Epoxy, 2.5 Gram Packet (Ground Shipment Only)\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eEPO-TEK® 353NDT is a two-component, highly thixotropic epoxy adhesive designed for applications requiring precise placement, non-flowing performance, and excellent thermal stability. Its paste-like consistency minimizes migration after dispensing, making it ideal for fiber optic assemblies, semiconductor packaging, medical devices, and electronic component bonding.\u003c\/p\u003e\n\u003cp\u003eFeaturing an extended working life of approximately 3 hours, 353NDT provides ample processing time for complex assembly operations while delivering strong mechanical bonds and reliable performance under elevated temperatures. This medical-grade epoxy is widely used in optical and microelectronic manufacturing environments where accurate adhesive placement and high-temperature resistance are critical.\u003c\/p\u003e\n\u003cp\u003eThe convenient 2.5-gram packet contains pre-measured resin and hardener components for easy mixing and dispensing.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ePlease Note: Ground Shipment Only\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eFeatures \u0026amp; Benefits\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eHighly thixotropic, non-sag, non-flowing formulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eExtended 3-hour working life for assembly flexibility\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-temperature resistance with Tg up to 90°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eStrong adhesion with die shear strength ≥15 kg\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuitable for precision fiber optic and optoelectronic assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMedical-grade epoxy formulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eIdeal for semiconductor, hybrid, and microelectronics packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConvenient 2.5 gram packet packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTypical Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic component assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOpto-electronic packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eEndoscope manufacturing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSemiconductor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eWafer-level packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUnderfill applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePCB-level assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHybrid microelectronics\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eCircuit and electronic component bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eProperty\u003c\/th\u003e\n\u003cth\u003eValue\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003eTwo-Part Epoxy Adhesive\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eColor\u003c\/td\u003e\n\u003ctd\u003eAmber\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConductivity\u003c\/td\u003e\n\u003ctd\u003eNon-Conductive\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCure Type\u003c\/td\u003e\n\u003ctd\u003eHeat Cure\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Components\u003c\/td\u003e\n\u003ctd\u003e2\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePot Life\u003c\/td\u003e\n\u003ctd\u003e3 Hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eViscosity\u003c\/td\u003e\n\u003ctd\u003e9,000 – 15,000 cPs @ 20 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThixotropic Index\u003c\/td\u003e\n\u003ctd\u003e3.8\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGlass Transition Temperature (Tg)\u003c\/td\u003e\n\u003ctd\u003e90°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHardness\u003c\/td\u003e\n\u003ctd\u003eShore D 80\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDie Shear Strength\u003c\/td\u003e\n\u003ctd\u003e≥15 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCoefficient of Thermal Expansion (CTE)\u003c\/td\u003e\n\u003ctd\u003e43 × 10⁻⁶ in\/in\/°C (below Tg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003eN\/A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRefractive Index\u003c\/td\u003e\n\u003ctd\u003eN\/A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSpectral Transmission\u003c\/td\u003e\n\u003ctd\u003eN\/A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eRecommended Cure Schedule\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e150°C for 1 minute\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e120°C for 5 minutes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e100°C for 10 minutes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e80°C for 30 minutes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eMarkets Served\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eElectronics Assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical Manufacturing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMedical Devices\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSemiconductor Manufacturing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHybrid Microelectronics\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49084554182912,"sku":"353NDT-2.5G","price":27.63,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3435BI9736_9765_EPO_TEK_r__353NDT_Thixotropic_High_Temperature_Epoxy_Heat_Cure_2_IMD_737d8131-651c-49ac-8771-cab1c480b7c4.webp?v=1785215079","url":"https:\/\/alotechparts.com\/products\/epo-tek-353ndt-heat-cure-extended-working-life-2-part-epoxy-25-gram-packet-ground-shipment-only","provider":"Alo Tech Solutions","version":"1.0","type":"link"}