{"product_id":"epo-tek-353nd-high-temperature-epoxy-heat-cure-4g","title":"EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (4g)","description":"\u003ch1\u003eEPO-TEK® 353ND High Temperature Epoxy, Heat Cure (4g Packet)\u003c\/h1\u003e\n\u003cp\u003eEPO-TEK® 353ND is an industry-leading, two-part high-temperature epoxy designed for demanding semiconductor, fiber optic, medical, hybrid microelectronics, and aerospace applications. Known for its exceptional reliability, low outgassing characteristics, and superior resistance to moisture and harsh environments, 353ND has become one of the most widely specified optical and electronic assembly adhesives in the industry.\u003c\/p\u003e\n\u003cp\u003eThis high-performance epoxy provides strong adhesion, excellent thermal stability, and outstanding optical transmission properties, making it ideal for fiber optic packaging, active optical alignment, semiconductor packaging, and high-reliability electronic assemblies.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 4-gram packet for accurate mixing and reduced waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eIndustry-Proven High-Reliability Epoxy\u003c\/h3\u003e\n\u003cp\u003eWidely used in semiconductor, fiber optic, aerospace, and medical device manufacturing where long-term performance is critical.\u003c\/p\u003e\n\u003ch3\u003eHigh Temperature Performance\u003c\/h3\u003e\n\u003cp\u003eDesigned to withstand demanding thermal environments while maintaining bond strength and reliability.\u003c\/p\u003e\n\u003ch3\u003eLow Outgassing Formulation\u003c\/h3\u003e\n\u003cp\u003eMeets NASA ASTM E595 low outgassing requirements when cured according to the recommended schedule, making it suitable for vacuum and aerospace applications.\u003c\/p\u003e\n\u003ch3\u003eVisual Cure Verification\u003c\/h3\u003e\n\u003cp\u003eChanges to an amber color after curing, allowing easy visual confirmation of proper processing.\u003c\/p\u003e\n\u003ch3\u003eExcellent Moisture Resistance\u003c\/h3\u003e\n\u003cp\u003eProvides long-term protection in humid and harsh environmental conditions.\u003c\/p\u003e\n\u003ch3\u003eOutstanding Optical Performance\u003c\/h3\u003e\n\u003cp\u003eOffers excellent transmission in the near-infrared wavelength range commonly used in fiber optic communications.\u003c\/p\u003e\n\u003ch3\u003eElectrically and Thermally Insulating\u003c\/h3\u003e\n\u003cp\u003eSuitable for electronic packaging and electrical insulation applications.\u003c\/p\u003e\n\u003ch3\u003eTelcordia Qualified Design\u003c\/h3\u003e\n\u003cp\u003eDesigned to meet Telcordia GR-1221 requirements for fiber optic component applications.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Heat Cure Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 4 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConsistency: Pourable Liquid\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eViscosity at 23°C: 3,000 to 5,000 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): ≥ 90°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 85\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuggested Operating Temperature:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 350°C Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 662°F Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRefractive Index (Uncured): 1.5694 at 589 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCoefficient of Thermal Expansion (CTE)\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eBelow Tg: 54 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAbove Tg: 206 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eOptical Properties\u003c\/h2\u003e\n\u003ch3\u003eSpectral Transmission\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e≥ 50% at 550 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e≥ 98% at 800–1000 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e≥ 95% at 1100–1600 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWorking Life (Pot Life): Up to 3 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Centrifuge Cycle: 5 Minutes at 3,500 RPM\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Cure Schedule: 1 Hour at 150°C (302°F)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003ch3\u003eFiber Optic Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic connector termination\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic component packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eActive optical alignment\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eEnvironmental sealing of opto-electronic packages\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eV-groove array assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber ferrule bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical communication components\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSemiconductor Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWafer-to-wafer bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eChip scale package (CSP) assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMEMS device fabrication\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFlip chip underfill\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHybrid and Sensor Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eNear-hermetic sealing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUltra-high vacuum (UHV) sensor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-temperature electronic packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDown-hole petrochemical fiber optic sensors\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eIndustrial sensing systems\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eElectronics Assembly\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eCapacitor fabrication\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePZT ferroelectric lamination\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMotor and inductor coil insulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFerrite core bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMagnet bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHard disk drive assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eStructural electronic packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49083454390528,"sku":"ET353ND-4G","price":33.92,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3439BI9690_1170_EPO_TEK_r__353ND_High_Temperature_Epoxy_Heat_Cure_4g_IMD_2da74d96-0b02-4469-8dfe-6567bc34a26b.webp?v=1785199855","url":"https:\/\/alotechparts.com\/products\/epo-tek-353nd-high-temperature-epoxy-heat-cure-4g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}