{"product_id":"epo-tek-323lp-high-temperature-epoxy-heat-cure-25g","title":"EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (2.5g)","description":"\u003ch1\u003eEPO-TEK® 323LP Extended Pot Life High Temperature Optical Epoxy, Heat Cure (2.5g Packet)\u003c\/h1\u003e\n\u003cp\u003eEPO-TEK® 323LP is a premium two-part heat-cure optical epoxy designed for demanding fiber optic, photonics, semiconductor, hybrid microelectronics, and electronic assembly applications. Developed as an extended working life alternative to EPO-TEK® 353ND, it provides exceptional thermal stability, optical transmission, and long-term reliability while offering an industry-leading 24-hour pot life.\u003c\/p\u003e\n\u003cp\u003eIts low-viscosity formulation enables excellent wetting, capillary flow, and optical bonding performance, making it ideal for fiber optic packaging, ferrule bonding, active optical alignment, and precision photonic assemblies. With outstanding optical transmission across visible and near-infrared wavelengths, EPO-TEK 323LP is an excellent choice for applications requiring both high optical performance and extended processing time.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 2.5-gram packet for accurate mixing and reduced material waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eUltra-Long 24-Hour Working Life\u003c\/h3\u003e\n\u003cp\u003eProvides significantly longer processing time than conventional optical epoxies, making it ideal for complex assemblies, extended alignment procedures, and batch manufacturing.\u003c\/p\u003e\n\u003ch3\u003eHigh Temperature Performance\u003c\/h3\u003e\n\u003cp\u003eDesigned for demanding environments and capable of withstanding field conditions exceeding 200°C.\u003c\/p\u003e\n\u003ch3\u003eExcellent Optical Transmission\u003c\/h3\u003e\n\u003cp\u003eProvides outstanding transmission performance across visible and near-infrared wavelengths commonly used in fiber optic communication systems.\u003c\/p\u003e\n\u003ch3\u003eVisual Cure Verification\u003c\/h3\u003e\n\u003cp\u003eChanges to an amber color after curing, allowing easy confirmation of proper processing.\u003c\/p\u003e\n\u003ch3\u003eDesigned for Fiber Optic Applications\u003c\/h3\u003e\n\u003cp\u003eDeveloped to meet Telcordia GR-1221 requirements for fiber optic component packaging and assembly.\u003c\/p\u003e\n\u003ch3\u003eStrong Mechanical Performance\u003c\/h3\u003e\n\u003cp\u003eOffers high shear strength, excellent durability, and long-term environmental stability.\u003c\/p\u003e\n\u003ch3\u003eElectrically Insulating\u003c\/h3\u003e\n\u003cp\u003eSuitable for electronic packaging, dielectric applications, and electrical insulation requirements.\u003c\/p\u003e\n\u003ch3\u003eLow Viscosity for Precision Bonding\u003c\/h3\u003e\n\u003cp\u003eFlows easily into ferrules, optical assemblies, and small cavities where controlled wetting is required.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Heat Cure Optical Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 2.5 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConsistency: Pourable Liquid\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eColor Before Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003ePart A: Clear to Slight Yellow\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePart B: Yellow\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePhysical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eViscosity at 23°C: 3,500 to 5,000 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): ≥ 100°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 88\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eStorage Modulus: 444,110 psi\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuggested Operating Temperature:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eUp to 300°C Intermittent\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eMechanical Properties\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eLap Shear Strength at 23°C: Greater Than 2,000 psi\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDie Shear Strength at 23°C: ≥ 20 kg (7,112 psi)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCoefficient of Thermal Expansion (CTE)\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eBelow Tg: 51 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAbove Tg: 185 × 10⁻⁶ in\/in\/°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThermal Weight Loss\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e0.31% at 200°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e0.46% at 250°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e0.85% at 300°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eElectrical Properties\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eVolume Resistivity at 23°C: ≥ 3 × 10¹² Ohm-cm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDielectric Constant (1 kHz): 2.62\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDissipation Factor (1 kHz): 0.003\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eOptical Properties\u003c\/h2\u003e\n\u003ch3\u003eSpectral Transmission\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e≥ 90% at 640–800 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e≥ 94% at 820–1620 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eRefractive Index\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e1.5704 at 589 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWorking Life (Pot Life): Up to 24 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRecommended Cure Schedule: 150°C (302°F) for 1 Hour\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003ch3\u003eFiber Optic and Photonics Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eFiber ferrule bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic connector assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic component packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eActive optical alignment\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eV-groove array assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptoelectronic package sealing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical sensor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eLight transmission applications from 800–1550 nm\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSemiconductor Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eWafer-to-wafer bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eChip scale package (CSP) assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMEMS fabrication\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFlip-chip underfill\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHybrid and Sensor Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eNear-hermetic sealing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eUltra-high vacuum sensor packaging\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHigh-temperature sensor assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eDown-hole fiber optic sensing systems\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eElectronics Assembly\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eCapacitor fabrication\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePZT piezoelectric lamination\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMotor winding insulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eInductor coil impregnation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFerrite core bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMagnet bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eWhy Choose EPO-TEK 323LP?\u003c\/h2\u003e\n\u003cp\u003eEPO-TEK 323LP combines excellent optical transmission, high-temperature performance, and exceptional reliability with an extended 24-hour working life. For applications requiring maximum assembly time, precision optical alignment, or large-scale production processing, it offers one of the longest pot lives available among high-performance optical epoxies.\u003c\/p\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Epo-Tek","offers":[{"title":"Default Title","offer_id":49083454030080,"sku":"ET323LP-2.5G","price":27.2,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0388\/5331\/2557\/files\/PR3443BI9738_38447_EPO_TEK_r__323LP_High_Temperature_Epoxy_Heat_Cure_2_5g_IMD_e0e047d0-8671-4eb7-a346-4ee31bfa30bf.webp?v=1785199846","url":"https:\/\/alotechparts.com\/products\/epo-tek-323lp-high-temperature-epoxy-heat-cure-25g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}