{"product_id":"angstrombond-ab9590-thermally-conductive-black-epoxy-room-temperature-cure-25g","title":"ÅngströmBond® AB9590 Thermally Conductive Black Epoxy, Room Temperature Cure (2.5g)","description":"\u003cp\u003e\u003cspan style=\"color: rgb(255, 42, 0);\"\u003e\u003cstrong\u003eMinimum Order Quantity: 25x\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003ch1\u003eÅngströmBond® AB9590 Thermally Conductive Black Epoxy, Room Temperature Cure (2.5 g)\u003c\/h1\u003e\n\u003cp\u003e\u003cstrong\u003ePart Number:\u003c\/strong\u003e AB9590-2.5G\u003c\/p\u003e\n\u003cp\u003eThe ÅngströmBond® AB9590 is a two-part, thermally conductive epoxy adhesive and potting compound designed for applications requiring both efficient heat transfer and mechanical flexibility. Its room-temperature curing formulation makes it ideal for bonding, encapsulating, and protecting sensitive electronic assemblies without the need for elevated-temperature curing equipment.\u003c\/p\u003e\n\u003cp\u003eUnlike rigid thermal epoxies that can place stress on delicate components, AB9590 cures to a flexible, resilient material that helps protect fragile electronic devices, fine-gauge wires, sensors, and temperature-sensitive assemblies. The low mixed viscosity allows the epoxy to flow easily into small gaps and complex geometries, making it suitable for potting, encapsulation, coating, and adhesive bonding applications.\u003c\/p\u003e\n\u003cp\u003eThe black epoxy formulation provides thermal conductivity while delivering reliable environmental protection against vibration, mechanical shock, and handling stresses. Its combination of thermal management properties and flexible cured characteristics makes AB9590 an excellent choice for electronics, optoelectronics, photonics, and industrial applications.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 2.5 g packet, AB9590 is ideal for prototyping, laboratory work, small-scale production, and field repair applications.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eTwo-part thermally conductive epoxy adhesive and potting compound\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eRoom-temperature curing formulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFlexible cured material for sensitive and fragile components\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eExcellent for bonding, potting, and encapsulation applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eLow mixed viscosity for easy dispensing and application\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eHelps dissipate heat from electronic assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSuitable for fine electrical wires and delicate devices\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eBlack epoxy formulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eProvides environmental and mechanical protection\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eConvenient 2.5 g package for small-volume applications\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003ePhysical Properties\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eProperty\u003c\/th\u003e\n\u003cth\u003eValue\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eColor\u003c\/td\u003e\n\u003ctd\u003eBlack\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eViscosity\u003c\/td\u003e\n\u003ctd\u003e30,000 cps\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShore A Hardness\u003c\/td\u003e\n\u003ctd\u003e\u0026lt;80\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003e0.946 W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temperature Range\u003c\/td\u003e\n\u003ctd\u003e-20°C to 100°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temperature Range\u003c\/td\u003e\n\u003ctd\u003e-4°F to 212°F\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eHandling Characteristics\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eProperty\u003c\/th\u003e\n\u003cth\u003eValue\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Time at 25°C (77°F)\u003c\/td\u003e\n\u003ctd\u003e45 Minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eCure Schedule\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eCure Stage\u003c\/th\u003e\n\u003cth\u003eTime\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e80% Strength\u003c\/td\u003e\n\u003ctd\u003e16 Hours at 25°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFull Cure (100% Strength)\u003c\/td\u003e\n\u003ctd\u003e112 Hours at 25°C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eElectronic component bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eThermal management assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePotting and encapsulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSensor protection\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic and photonics assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFine-wire electrical connections\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eLaboratory and prototype development\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eIndustrial electronic equipment\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003ePackaging\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e2.5 g packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eImportant Notice\u003c\/h2\u003e\n\u003cp\u003eShelf life information is available upon request. Store according to manufacturer recommendations to maximize product performance and working life.\u003c\/p\u003e","brand":"Fosco Connect","offers":[{"title":"Default Title","offer_id":49083449934080,"sku":"AB9590-2.5G","price":62.82,"currency_code":"USD","in_stock":true}],"url":"https:\/\/alotechparts.com\/products\/angstrombond-ab9590-thermally-conductive-black-epoxy-room-temperature-cure-25g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}