{"product_id":"angstrombond-ab9001mtup-thixotropic-clear-epoxy-room-temperature-heat-cure-25g","title":"ÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature \u0026 Heat Cure (2.5g)","description":"\u003ch1\u003eÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature \u0026amp; Heat Cure (2.5g Packet)\u003c\/h1\u003e\n\u003cp\u003eÅngströmBond® AB9001MTUP is a high-viscosity, thixotropic two-part epoxy specifically designed for MT and MTRJ fiber optic connector assemblies. Its non-sagging consistency helps keep the adhesive precisely where it is applied, making it ideal for connector termination, sealing, and encapsulation applications that require controlled epoxy placement.\u003c\/p\u003e\n\u003cp\u003eThis clear epoxy cures at room temperature or with heat and is formulated to produce minimal stress during curing. The low-stress characteristics help prevent fiber cracking and maintain long-term reliability in both single-mode and multimode fiber optic connectors. The clear finish also allows for easy inspection and polishing during connector manufacturing.\u003c\/p\u003e\n\u003cp\u003eSupplied in a convenient 2.5-gram packet for accurate mixing and reduced waste.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Benefits\u003c\/h2\u003e\n\u003ch3\u003eDesigned for MT and MTRJ Connectors\u003c\/h3\u003e\n\u003cp\u003eOptimized for multi-fiber connector assemblies where precise adhesive placement and low curing stress are critical.\u003c\/p\u003e\n\u003ch3\u003eThixotropic Non-Sag Formula\u003c\/h3\u003e\n\u003cp\u003eHigh viscosity prevents epoxy flow and migration, allowing accurate placement during assembly and curing.\u003c\/p\u003e\n\u003ch3\u003eLow-Stress Curing Performance\u003c\/h3\u003e\n\u003cp\u003eHelps eliminate fiber cracking and reduces stress on both single-mode and multimode optical fibers.\u003c\/p\u003e\n\u003ch3\u003eClear for Easy Inspection and Polishing\u003c\/h3\u003e\n\u003cp\u003eTransparent cured epoxy simplifies polishing operations and visual inspection of connector end faces.\u003c\/p\u003e\n\u003ch3\u003eExcellent Sealing and Encapsulation Properties\u003c\/h3\u003e\n\u003cp\u003eAn excellent choice for sealing, potting, and encapsulating small optical and electronic assemblies.\u003c\/p\u003e\n\u003ch3\u003eStrong Multi-Substrate Adhesion\u003c\/h3\u003e\n\u003cp\u003eBonds securely to glass, ceramics, metals, and many engineering plastics.\u003c\/p\u003e\n\u003ch3\u003eResistant to Harsh Environments\u003c\/h3\u003e\n\u003cp\u003eProvides excellent impact resistance as well as resistance to moisture and many industrial chemicals.\u003c\/p\u003e\n\u003ch3\u003eFlexible Processing Options\u003c\/h3\u003e\n\u003cp\u003eCan be cured at room temperature or with heat to accommodate various production requirements.\u003c\/p\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eProduct Type: Two-Part Thixotropic Epoxy\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePackage Size: 2.5 g Packet\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eColor: Clear\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMixed Viscosity at 25°C: 50,000 to 55,000 cPs\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlass Transition Temperature (Tg): 93°C\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eShore D Hardness: 78\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eService Temperature Range: -65°C to 130°C (-85°F to 266°F)\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHandling and Processing\u003c\/h2\u003e\n\u003ch3\u003eWorking Life\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e30 to 45 Minutes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eRecommended Centrifuge Cycle\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e5 Minutes at 3,500 RPM\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eMinimum Cure Schedules\u003c\/h2\u003e\n\u003ch3\u003eRoom Temperature Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e25°C: 18 Hours\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAccelerated Heat Cure\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e65°C: 1 Hour\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e90°C: 15 Minutes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eMT connector assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMTRJ connector assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMulti-fiber connector termination\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSingle-mode fiber optic connectors\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eMultimode fiber optic connectors\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic ferrule bonding\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eOptical component assembly\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePotting and encapsulation\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eSealing small optical assemblies\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eTelecommunications manufacturing\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eFiber optic production environments\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eStorage and Shelf Life\u003c\/h2\u003e\n\u003cp\u003eStore refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.\u003c\/p\u003e","brand":"Fosco Connect","offers":[{"title":"Default Title","offer_id":49083454652672,"sku":"AB9001MTUP-2.5G","price":18.62,"currency_code":"USD","in_stock":true}],"url":"https:\/\/alotechparts.com\/products\/angstrombond-ab9001mtup-thixotropic-clear-epoxy-room-temperature-heat-cure-25g","provider":"Alo Tech Solutions","version":"1.0","type":"link"}